Izisetshenziswa ze-PCB kanye Nenqubo

1. Ukukhiqizwa Kwemibhalo Yobunjiniyela

Emkhakheni wokukhiqiza we-PCB, i-CAM (I-Computer-Aided Manufacturing) ivela njengobuchwepheshe obubalulekile, ihlela ukuguqulwa kwemiklamo yebhodi lesifunda ibe idatha ebalulekile kanye namafayela enqubo adingekayo ukuze kwenziwe izinto ezibonakalayo. Emgogodleni wayo, i-CAM isebenza njengomzila wokudlulisa idatha yedizayini yebhodi lesifunda ibe yidatha yokukhiqiza, ehloselwe ukuhlanganiswa ngaphakathi kwezinqubo zokuthwebula izithombe kanye nezivumelwano zokumba.
Ngaphakathi komkhakha wokukhiqiza we-PCB, i-CAM yenza indima ehlukahlukene, ehlanganisa:Ukuguqulwa kwedatha ye-Gerber,Ukuhlaziywa kwenqubo,Ukwenziwa ngcono kwenqubo,Ukusethwa kwenqubo,Ukukhishwa kwamafayela okuzulazula,Ukuqinisekiswa kwenqubo,Ukuphathwa kwedatha;Kafushane, isofthiwe ye-CAM isebenza njengebhuloho elixhumanisa ukwakhiwa kokukhiqiza. , okuvumela ukuguqulwa kwedatha okushelelayo kube yimikhiqizo ye-PCB yangempela.

2. Ukusika Izinto

Ukuqaliswa kokukhiqizwa kwe-PCB kuqala ngokusetshenziswa kweshidi elikhulu lezinto. Ngokubona izithiyo ezilethwa imishini yokukhiqiza ye-PCB ekhona kanye namandla okukhiqiza, indawo yokukhiqiza ibeka imingcele ethile ehlanganisa kokubili imikhawulo ephansi nengaphezulu ephathelene nokucubungula ubukhulu. Ukuqinisekisa ukubambelela kule mininingwane enembayo, izigaba zokuqala zibandakanya ukunamathela ngokucophelela emiyalweni yokukhiqiza (MI). Lokhu kugunyaza ukusetshenziswa kokuqala komshini wokusika ozishintshayo ukuze kuhlukaniswe ngokunembile impahla eluhlaza, ebizwa ngokuthi i-Copper Clad Laminate (CCL), ibe izilinganiso eziqondana ngaphandle komthungo nosayizi wokucubungula omisiwe. Lesi sigaba sokulungiselela sibaluleke kakhulu ezigabeni ezilandelayo zokukhiqiza, sigcizelela ukunemba kanye nendlela ye-methodical ebalulekile ekwenziweni kwe-PCB.

3. Phrinta izendlalelo zangaphakathi

Iphethini yesifunda idluliselwa endaweni yebhodi kusetshenziswa i-photomask kanye nokuvezwa kwe-UV ye-photosensitive dry film laminate. Ukukhanya kwe-UV kubangela i-polymerization ezindaweni ezisobala zefilimu eyomile. Inqubo ye-photolithography yenziwa endaweni ehlanzekile yekamelo.
I-Imaging inqubo yokuguqula idatha yedizayini ye-elekthronikhi ibe yifomethi efundeka i-optical plotter. I-photoplotter ibe isisebenzisa ukukhanya kwe-ultraviolet ukuveza isithombe esingesihle sephethini yesekethe ngqo kuphaneli noma ifilimu ye-photomask.

4. I-inner layer etching

Ukufakwa kwezingqimba zangaphakathi, lokhu kuyinqubo ebalulekile. Umgomo lapha uwukukhipha ngokunembile ithusi eleqile kuphaneli ngenqubo ye-etch ehlelwe kahle. Ngemva kokuqeda lesi sigaba esibucayi, ifilimu eyomile esele ikhishwa ngokucophelela, ishiya isifunda sethusi esilungiselelwe ngokucophelela esibonisa kahle inkimbinkimbi yomklamo ocacisiwe.

5. I-Inner Layer AOI

I-Inner Layer Automatic Optical Inspection (AOI) e-Highleap iyindawo yokulawula ikhwalithi ebalulekile. Le nqubo eyinkimbinkimbi iqhathanisa kahle i-circuitry nezithombe zedijithali ukuze kuqinisekiswe ukuqondana kwedizayini nokuqeda ukungapheleli. Ukuskena kwebhodi okuphelele nokuhlolwa ochwepheshe abaqeqeshwe kakhulu kuthola noma yikuphi okudidayo. Ngokuphawulekayo, i-Highleap iphakamisa izinga eliqinile - amasekhethi avulekile awalungiswa. Lokhu kuzibophezela kuyisibonelo sokuzinikela kwethu kwikhwalithi engayekethisi.

6. Ukuxhuma

Inqubo ye-PCB ensundu ye-oxide, eyaziwa nangokuthi inqubo ye-PCB brownization noma inqubo ye-oxide emnyama, isebenza inhloso yokuthuthukisa ukunamathela nokuthengiswa kwezindawo zethusi ebhodini lesifunda. Le nqubo ihilela i-oxidation yamakhemikhali elawulwayo yethusi eveziwe, yakhe ungqimba oluncane lwe-oxide ensundu noma emnyama endaweni yethusi. Lesi singqimba se-oxide sithuthukisa ukuhlangana phakathi kwethusi nezinto ze-substrate, kanye nokukhuthaza ukumanzisa okungcono ngesikhathi senqubo yokuhlanganisa. Ukwengeza, ungqimba lwe-oxide olunsundu lusebenza njengesivikelo esivikelayo, luvikela imikhondo yethusi ku-oxidation futhi luqinisekise impilo yeshelufu ende nokusebenza okuthembekile kwe-PCB.

7. I-Lay-up and Bond (Lamination)

Izendlalelo zangaphakathi ziyafakwa i-oxidized bese ziyapakishwa futhi ziqondaniswe ukuze zakhe isakhiwo sebhodi. I-Prepreg material ihlukanisa izendlalelo njenge-insulator, kuyilapho ama-foil ethusi engezwa phezulu nangaphansi. Inqubo yokugcoba ihlanganisa ngokunembile ukushisa, ingcindezi, ne-photoresist ukuze kwakhe i-laminate ehlangene. Izendlalelo zishiselwa ku-375°F futhi zicindezelwe ukusuka ku-275-400 psi. Ngemuva kokuphulukisa ekushiseni okuphezulu, ukucindezela kukhishwa kancane kancane futhi ibhodi lipholile ngokulandelana okulawulwayo. Le nqubo yokucophelela idala umsindo, i-PCB yekhwalithi ephezulu.

8. Ukubhoboza i-PCB

Inqubo yokumba ye-PCB ibalulekile ekudaleni ukuxhumana phakathi kwezendlalelo. Izimbobo ezaziwa ngokuthi i-vias zivumela ukulandelelwa kanye nezingxenye ukuthi zixhume kuwo wonke amabhodi ezendlalelo eziningi, okuvumela ukujikeleza okuyinkimbinkimbi ukuthi kusebenze. Ukwengeza, izimbobo zibhojwa ukuze kusetshenziswe izingxenye zembobo kanye namaphoyinti okugxumeka. Ukunemba ukunemba kubalulekile ukuze kuqinisekiswe ukuqondanisa okufanele nokuxhumana ekwakhiweni kwe-PCB.

Kwa-Highleap, sisebenzisa izimbobo ezilawulwa izinombolo kanye nesofthiwe ethuthukisiwe ukuze sikhiqize amabhodi anezimbobo ezinembe kakhulu. Zombili izimbobo eziyindilinga nezimbobo eziwunxande ziyabhojwa ukuze zihambisane nesakhiwo ngokunembile. Lokhu kuqinisekisa ubuqotho bomklamo kungakhathaliseki ukuthi nge-vias, izingxenye, noma ukuguquguquka ekubekeni. Ngaphezu kwalokho, sinikeza amakhono okugaya slot metalized. Le nqubo imishini imisele ezingqimbeni zethusi ze-PCB bese i-electroplates ezindongeni ze-slot ukuze idale izindlela ezisebenzayo. Izikhala zensimbi zenza imisebenzi ekhethekile njengezintambo zokudlulisa i-RF noma ukuxhunywa kwamandla amanje aphezulu. Ngobuchwepheshe bokubhola okunembayo nokugaya ngensimbi, i-Highleap iletha ama-PCB anekhwalithi ephakeme yembobo nokusebenza okuthuthukile.

9. I-electroless copper deposition

I-electroless copper deposition yakha ungqimba lwethusi oluthambile ezindongeni zangaphakathi zezimbobo ezibhoboziwe, okubonisa ukuqhubeka kukagesi phakathi kwezingqimba. Le nqubo yamakhemikhali enembile idinga ukulawula ngokucophelela ukuze kuqinisekiswe idiphozithi ethembekile ngisho nasezindaweni ezingezona ezensimbi. Okulandelayo kwembobo yembobo kuvala izindonga zembobo nendawo yebhodi ngalokhu kunamathela kwethusi okuncanyana.

Kwa-Highleap, silinganisela ngobuchwepheshe ukujiya kwe-copper plating phakathi kwama-microns angu-5-8 ngesikhathi sokucwecwa kwephaneli. Lokhu kulandela isendlalelo sokuqala se-PTH futhi kuthuthukisa ithusi ukuze lifakwe ngokulandelayo ngokuya ngethrekhi eqondile kanye nokucaciswa kwegebe. I-orchestration yethu yokucophelela igcwalisa izimfuneko ze-PCB ezidingeka kakhulu.

10. Ifilimu eyomile yangaphandle (Isithombe sezingxenye ezingaphandle)

I-lamination yangaphandle yefilimu eyomile kusetshenziswa i-photosensitive coating kwizendlalelo zethusi zangaphandle ze-PCB ngaphambi kokuthwebula nokushumeka. I-photoresist yefilimu eyomile ivikela ithusi ngesikhathi sokuqopha ukuze yenze ama-conductor kanye nemikhondo. Okokuqala, ukushisa nokucindezela kuhambisana nefilimu eyomile. Okulandelayo, ukuvezwa kwe-UV nge-photomask nokuthuthukisa kudala iphethini yokumelana. I-photoresist esele ivikela iminonjana yethusi ekushubeni. Ekugcineni, ifilimu eyomile ihlutshiwe, ishiya kuphela iphethini yomqhubi oyifunayo.

Kwa-Highleap, sisebenzisa i-lamination ethuthukisiwe nezinqubo zokuchayeka ezibalulekile ukuze kuzuzwe izinqumo zomugqa omuhle nokubekezelela okuqinile. Ubuchwepheshe bethu bokwenza iphethini yefilimu eyomile yongqimba lwangaphandle bukhiqiza ama-PCB anamakhondaktha wekhwalithi ephezulu kakhulu.

11. I-Graphic Plating

I-Electroplating ekwenziweni kwe-PCB ibalulekile ekuthuthukiseni ubuqotho bokujikeleza nokuhamba kahle. Inqubo isebenzisa ukubekwa kwe-electrochemical okulawulwayo ukuze kumbeswe ngokunembile izindawo zebhodi eziqokiwe ngelendlalelo yethusi elikhulu. I-Electroplating ayigcini nje ngokuqinisa i-trace kanye ne-pad conductivity kodwa futhi inika amandla ukudalwa kwezici ezinhle ngokwezicaciso zedizayini.

Kwa-Highleap, senza i-electroplating ngokunakekela okucophelela nangokunemba. Lokhu kuthuthukisa ukuqina okuphelele nokusebenza kukagesi kwe-PCB eqediwe. Ubuchwepheshe bethu bokufakwa kwe-electrochemical deposition bukhiqiza amabhodi wesekethe ane-circuitry eqinile, ethembekile eklanyelwe ukusebenza.

12. Faka ungqimba lwangaphandle

Ukufakwa kwesendlalelo sangaphandle ekwenziweni kwe-PCB kubalulekile ekucwengeni iphethini yokujikeleza endaweni yebhodi. Inqubo yamakhemikhali elawulwayo isusa ithusi eleqile ezindaweni ezingaqokiwe, ishiya imikhondo echazwe ngokunembile, amaphedi, nokuxhumana. I-Etching idala idizayini ehlosiwe ngokuqondanisa ukwakheka kwesekethe ngokunembile. Iphinde inike amandla izici eziyinkimbinkimbi kanye nobukhulu bethrekhi obulungiselelwe.

Ukuhlelwa okucophelelayo kokufakwa kwesendlalelo sangaphandle kunikela kakhulu ekunembeni, ekuthembekeni, nasekusebenzeni komkhiqizo wokugcina we-PCB. Lokhu kugcizelela ukubaluleka kwe-etching ekukhiqizeni amasistimu kagesi. Indlela yokubhala efanele ibalulekile kumabhodi ahlangabezana nemininingwane yokuklama.

13. Isendlalelo sangaphandle i-AOI

Isendlalelo sangaphandle Ukuhlola Okuzenzakalelayo Okuzenzakalelayo (AOI) kuqinisekisa ikhwalithi yamaphethini kakhondatha we-PCB ngemva kokunamathisela. Kwa-Highleap, i-AOI ethuthukisiwe iqhathanisa izendlalelo zesithombe nomklamo wangempela ukuze kutholwe ukuchezuka. Lokhu kuthola amaphutha afana nokuvula, izikhindi, ukwephulwa kwezikhala, nokonakala kwephedi kusenesikhathi.

I-Highleap isebenzisa idatha ye-AOI ukuze ikhombe ngokushesha futhi ixazulule izinkinga zenqubo ngokuhlaziywa kwezimpande. Sivimbela amabhodi anamaphutha ukuthi aqhubekele phambili ekucubunguleni. Le ndlela yempendulo ivumela ukuthuthukiswa okuqhubekayo kwamasu ethu okwenziwa. Ukusebenzisa ukuhlolwa kongqimba lwangaphandle okuqinile kubalulekile ukuze kuqinisekiswe ama-PCB athembekile, asebenza kahle kakhulu.

14. I-Soldermask

Uhlelo lokusebenza lwemaski ye-solder ekukhiqizeni i-PCB ludlala indima ebalulekile ekuvikeleni nasekuthuthukiseni ukwethembeka kokujikeleza. Isendlalelo semaski esithambile sigqoka izindawo lapho i-solder ingahlosiwe. Lokhu kuvikela iminonjana yethusi kanye nezingxenye ezivela kumabhuloho e-solder angahlosiwe, umswakama, uthuli nezinye izici zemvelo. Ukwengeza, imaski ye-solder iqondisa ukuhlangana ngokuvala i-solder ezindaweni ezikhethiwe.

Ngokusebenzisa ngokucophelela imaski ye-solder, inqubo ithuthukisa impilo ende, ukuthengiswa, kanye nekhwalithi iyonke ye-PCB yokugcina. Lokhu kuvumela ukuhlanganiswa okungenamthungo kuma-electronicssemblies. Imaski efanele ye-solder ibalulekile kumabhodi esekethe aqinile, athembekile.

15. Iegend & Silkscreen

Inqubo yokuphrinta uhlamvu lwe-PCB inikeza ukuhlonza okubonakalayo okucacile ngokusebenzisa amalebula ngokuqondile, izimpawu, nokumaka kwezinhlamvu nezinombolo. Lezi zimpawu ezifundekayo nezihlala njalo zinikeza ulwazi olubalulekile njengabaklami bezingxenye, izinombolo zereferensi, amalogo, nemininingwane yokukhiqiza. Ukuhlanganiswa kwezinsiza zokuphrinta izinhlamvu, ukulungisa iphutha, nokugcinwa ngokulungiselela ukuphatha kwe-PCB okuphumelelayo nokungenaphutha. Lokhu kuthuthukisa ukuhleleka okuphelele, ukulandeleka, kanye nobungcweti bomkhiqizo wokugcina. Ukuphrinta nokulebula kwebhodi okuphumelelayo kwenza ukuxhumana nokusebenza okungenazihibe ngaphakathi kwezinhlelo ze-elekthronikhi eziyinkimbinkimbi.

16. surface Qeda

Ukuqedwa okuphezulu okuhlukahlukene kusetshenziswa ezifundeni zethusi eziveziwe kulandela ukwenziwa kwe-PCB. Lokhu kusebenzela ukuvikela indawo engaphezulu nokwandisa ukutholakala kwe-solderability. Ukuqedwa okujwayelekile kufaka i-Electroless Nickel Immersion Gold (ENIG), Hot Air Solder Leveling (HASL), kanye ne-Immersion Silver. Isiphetho ngasinye sisetshenziswa ngogqinsi olulawulwa ngokucophelela futhi sihlolelwa ukuthengiselana ukuze kuqinisekiswe ikhwalithi nokusebenza. Ukusetshenziswa kwamasu okungaphezulu kuvikela i-PCB futhi kuvumela ukuxhumana okuthembekile kwe-solder.

17. Ukuhlolwa kwe-elekthronikhi

Ukuhlolwa kwe-impedance nokuhlolwa kwe-elekthronikhi kubalulekile ekuqinisekiseni ukusebenza kwe-PCB nekhwalithi. Ukuhlolwa kwe-Impedans kuqinisekisa i-impedance yokulandela umkhondo, okubalulekile kumasekethe anesivinini esikhulu. Izilinganiso ezinembayo ziqinisekisa ukunamathela kumininingwane yedizayini, ithuthukisa ubuqotho besignali.

Ukuhlolwa kwe-elekthronikhi kuhlola ubuqotho besifunda ngokuhlonza ama-opens, izikhindi, nokuxhumana okufanele. Izindlela ezifana ne-flying probe kanye nokuhlolwa kwesakhiwo zihlolisisa ibhodi ngedatha yoqobo ukuze kuqinisekiswe ikhwalithi nokusebenza. Ngokuhlangene, lezi zigaba zokuhlola zisekela ukwethembeka, ukusebenza, nokunemba komkhiqizo wokugcina we-PCB.

I-18. Iphrofayela

Isigaba sephrofayela sihlanganisa ukusikwa okunembayo kwamaphaneli okukhiqiza abe osayizi abaqokiwe kanye nomumo, aqondaniswe ngokunembile nomklamo wekhasimende njengoba kushiwo kudatha ye-gerber. Le nqubo inikezela ngezinketho ezintathu eziyinhloko zokuhlinzekwa kwamalungu afanayo noma ukusatshalaliswa kwephaneli: ukushaya amagoli, umzila, noma ukubhoboza. Ngokunamathela ngokuqinile emidwebeni ehlinzekwe ngamakhasimende, zonke izilinganiso zibhekwa ngokucophelela ukuze kuqinisekiswe ukunemba kobukhulu nokuhambisana, nokuqinisekisa ukuthi iphaneli ifinyelela ifomu nobukhulu obufunwayo njengokucaciswa kwayo.